Sapphire is diamond ground using the same general processes as any dense alumina oxide material. While it tends to chip easier than alumina, simple grinding procedure and technic can accommodate this characteristic. Due to the relatively high cost of sapphire care should be taken to remove a minimal amount of material to reach the final […]
Critical parameters for grinding large sapphire window panels Joseph R. Bashe*, Gene Dempsey, Ikerionwu A. Akwani, Keith T. Jacoby, Douglas L. Hibbard Exotic Electro-Optics (EEO) Murrieta, CA ABSTRACT Advances in optical manufacturing and testing technologies for sapphire material are required to support the increasing
In order to improve the grinding wheel wear during the sapphire steep aspheric surface grinding process, a SiC-reinforced resin-bonded hemispherical diamond wheel was used and the arc envelope grinding performance was investigated. Firstly, the mapping relationship between the contours of the grinding wheel and the aspheric surface was established based on the grinding conditions. The …
study and design of experiment modelling of sapphire grinding, Journal of Cleaner Production (2016), doi: 10.1016/j.jclepro.2016.09.031. This is a PDF file of an unedited manuscript that has been accepted for publication. As a service to our customers we are providing this early version of the manuscript. The manuscript will undergo
Description: for LBO, BBO, Nd:YVO4 and KTP. In addition, we also provide Nd:YLF, Nd:YAG, KDP, KD*P, Ti: Sapphire, TGG and other crystals for laser and telecom industries.Consistent High quality: CASTECH has been recognized throughout the Optics industry for its outstanding quality and high . Capabilities: Coatings, Grinding and Polishing, High Volume Production
This paper reports our recent results on the diamond grinding process of single crystallized sapphire wafers. It was found that the diamond grains were severely dislodged at the wheel/ workpiece interface and the material was removed by a mixed process of both grinding and lapping. Grinding governed the wafer center while lapping dominated its fringe.
Sapphire Device Maker Thinning Process by DFG8330 7 There are two thinning methods in fixing sapphire wafers. Method Fixing on Substrate Fixing on Ring Frame Adhesive Wax Tape How it looks like Tools DFG8830 DGP8761 (Frame grinding spec) Positive G High fixing adhesive G Stable wafer edge in thinning G Rigid substrate G Automated process
2. The specific process of grinding and polishing of sapphire wafers. 1. Rough grinding: high hardness micro powder with particle size of 26-43um is used as abrasive, which is mixed with deionized water, dispersant and suspending agent to form coarse grinding fluid. The abrasive accounts for 15~30%. Then put them into the grinder for grinding. 2.
In order to improve the efficiency and reduce the cost of sapphire crystal machined by loose abrasive lapping, the fixed-abrasive diamond grinding tools for sapphire grinding were investigated in this paper. Four vitrified-resin composite bond diamond grinding tools with different grain sizes (40μm, 20μm, 7μm, 2.5μm) were developed. The grinding experiments were performed with the ...
US2248955A US250668A US25066839A US2248955A US 2248955 A US2248955 A US 2248955A US 250668 A US250668 A US 250668A US 25066839 A US25066839 A US 25066839A US 2248955 A US2248955 A US 2248955A Authority US United States Prior art keywords sapphire wheel groove roller grinding Prior art date Legal status (The legal status is an assumption and is not a legal …
The thinning of sapphire wafers is a key process that affects the quality of optoelectronic devices. In the grinding process for sapphire, a hard and brittle material, the grade and surface conditions (wearing and chip loading) of the grinding wheel are the key to continuous processing and reduction of defects. In industry, a common approach is to assume the possible causes of defects by ...
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